Flash memory architecture for optimizing performance of memory having multi-level memory cells

ABSTRACT

A flash memory device having a pipelined RAS/CAS architecture is logically organized as an array of rows and columns of multi-bit flash memory cells each capable of being selectively programmed to have a threshold voltage corresponding to one of a plurality of multi-bit bit-sets. In one embodiment, the memory device is adapted to perform a burst read operation in which a row of flash memory cells is sensed and latched and subsequently outputted from the device on consecutive clock cycles following a sense latency period. In accordance with one aspect of the invention, the pipelined architecture allows for a second burst read operation to be initiated prior to completion of the first, such that the sense latency periods for all but the first of a series of successive burst read operations are hidden, enabling the memory device to perform comparably to a memory device having conventional flash memory cells.

CROSS REFERENCE TO RELATED APPLICATIONS

This application is a continuation of U.S. application Ser. No.10/315,323, filed Dec. 10, 2003, which is incorporated herein byreference in its entirety, and to which priority is claimed.

FIELD OF THE INVENTION

This invention relates generally to semiconductor devices, and moreparticularly relates to flash memory devices.

BACKGROUND OF THE INVENTION

Electrically erasable and programmable memory devices having arrays ofwhat are known as flash memory cells are found in a wide variety ofelectrical devices. A flash cell, also called a floating gate transistormemory cell, is similar to a field effect transistor, having a channelregion between a source and a drain and a control gate over the channelregion. In addition the flash cell has a floating gate between thecontrol gate and the channel region. The floating gate is separated fromthe channel region by a layer of gate oxide, and an interpoly dielectriclayer separates the control gate from the floating gate. Both thecontrol gate and the floating gate are formed of doped polysilicon. Thefloating gate remains floating or electrically isolated. A flash cell isprogrammed by applying appropriate voltages to the control gate, thedrain, and the source, causing electrons to pass from the channel regionto the floating gate through the gate oxide. The voltage applied to thecontrol gate, called a programming voltage, determines the amount ofcharge residing on the floating gate after programming, and the chargedetermines the voltage that must be applied to the control gate in orderto allow the flash cell to conduct current between the source and thedrain. This voltage is termed the threshold voltage of the flash cell,and is the physical form of the data stored in the flash cell. As chargeis added to the floating gate the threshold voltage of the flash cellincreases.

Those of ordinary skill in the art will appreciate that a read operationfrom a flash memory device can be considered to comprise two sequentialstages. The first stage is a latch stage where the voltage level storedin the flash cell is sensed by sense amplifiers and latched into abuffer. The second stage is an output stage where the data latched inthe buffer is output to the data output (DQ) pins of the device. Withconventional flash memory architectures, the latch stage of a readoperation involves sensing the state of an entire row of memorylocations and latching the sensed values in a latch. This occurs inresponse to assertion of a “READ” signal. The data is available at thememory device's output pins some time after the READ signal has beenasserted.

The earliest flash memory devices were primarily asynchronous devices,meaning that no external clocking signal was required for theiroperation. The primary significant timing constraint for an asynchronousflash memory is a latency period following assertion of the READ commandbefore the data was available at the output (DQ) pins.

Later, synchronous flash memories were introduced. A synchronous flashmemory operates (or appears from external to the device to operate) inessentially the same manner as a conventional synchronous dynamic accessmemory (SDRAM). Data is read from a synchronous flash memory by firstasserting a row address strobe (RAS) signal to latch in a row addressapplied to the address inputs of the device, and subsequently assertinga column address strobe (CAS) signal to latch in a column address of thememory location to be accessed. Both RAS and CAS are asserted in aspecified timed relationship with a clock signal (CLK) defining theoperational speed of the memory device. A latency period followingassertion of the CAS signal, measured in terms of some number of clockcycles, must elapse before valid data stored at the addressed locationis available at the device's DQ output pins.

Examples of synchronous flash memory devices such as described generallyabove include the SynchFlash® family of synchronous flash memory devicescommercially available from Micron Technology, Inc., Boise, Id. (theAssignee of the present invention). Memories in the SynchFlash® familyfeature SDRAM-compatible interfaces (pinouts) and timing specifications.Synchronous flash memory architectures are also disclosed in detail inU.S. Pat. No. 6,314,049 to Roohparvar, entitled “Elimination ofPrecharge Operation in Synchronous Flash Memory,” and in U.S. Pat. No.6,327,202 to Roohparvar, entitled “Bit Line Pre-Charge in a Memory.” Theaforementioned '049 and '202 patents are commonly assigned to theAssignee of the present invention and are hereby incorporated byreference herein in their respective entireties.

As an improvement over conventional flash memories, it has been proposedin the prior art to utilize multi-bit flash memory cells (alternativelyreferred to as multi-level or multi-state flash cells) in a flash memoryto improve the capacity of the memory and the speed with which data canbe read from and written to the memory. A multi-bit or multi-state flashcell is a flash memory cell for which multiple, distinct thresholdvoltage levels are defined over a voltage range within the flash cell.Each distinct threshold voltage level corresponds to a set of data bits,with the number of bits representing the amount of data which can bestored in the multi-state flash cell. This method allows multiple bitsof binary data to be stored within a single flash cell. When reading thestate of the flash cell, the threshold voltage level for which the flashcell conducts current corresponds to a bit set representing dataprogrammed into the flash cell.

A multi-state flash cell is programmed by applying a programming voltageto the control gate and holding the drain to a constant voltage over aproper time period to store enough charge in the floating gate to movethe threshold voltage of the flash cell to a desired level. Thisthreshold voltage level represents a state of the flash cellcorresponding to the data (bit set) stored in the flash cell.

An example of a prior art flash memory device having multi-state memorycells is disclosed in U.S. Pat. No. 6,209,113 to Roohparvar, entitled“Method and Apparatus for Performing Error Correction on Data Read froma Multistate Memory.” The '113 patent is commonly assigned to theAssignee of the present invention and is hereby incorporated herein byreference in its entirety.

Those of ordinary skill in the art will appreciate that for amulti-state memory cell, the latch stage of a read cycle is inherentlyslower compared with single-bit flash memory cells, due mainly to thetime that is required to “resolve” the voltage on each cell. (Those ofordinary skill in the art will understand that to “resolve” the voltageon a flash memory cell involves sensing the voltage stored in the celland translating that voltage into one of a plurality of bit-sets definedfor that cell.) That is, a higher resolution of sensing is required todistinguish between the multiple logic levels, thus requiring moresensing time as compared with single-bit flash memory cells. Often, twoseparate sense amplifiers are involved in resolving the voltage levelstored in a multi-level cell. However, once the latching stage iscomplete for an addressed row of cells, the outputting stage of a readoperation is essentially the same for 1 bit-per-cell as for 2 (or more)bits-per-cell.

FIG. 1 a illustrates the cell data map for a conventionalone-bit-per-cell flash memory cell. As shown in FIG. 1 a, two separatelevels or ranges are defined within the overall flash cell Vthresholdrange. When reading from such a flash cell, all that is necessary is todetermine whether the threshold voltage is above or below the midpointbetween the two levels. Voltages in one level are interpreted as asingle binary bit (zero or one) while voltages in the other level areinterpreted as the complementary binary bit (one or zero).

FIG. 1 b on the other hand illustrates the cell data map for amulti-level flash memory cell capable of storing two bits. As can beseen in FIG. 1 b, the data map defines four separate ranges or levels(Levels 0, 1, 2, and 3) within the range of the cell's overall maximumVthreshold. Each level is assigned a two-bit pair or bit-set, 0,0, 0,1,1,0, or 1,1. The advantages of such multi-level cells are well known andappreciated by those of ordinary skill in the art. The perceiveddisadvantage of multi-level cells is that the time to resolve thecorrect voltage level is generally longer than for conventional flashmemory cells. One possible approach to sensing a multi-level cell suchas represented by the map of FIG. 1 b is to first sense whether thethreshold voltage is above or below the boundary between Level 1 andLevel 2, and next ascertain whether the threshold voltage is above orbelow the boundary between Level 0 and Level 1 or between Level 2 andLevel 3 (depending upon the outcome of the first sensing phase). Inimplementation, such an approach can require two sense amplifiers percell, and the overall sensing process can take substantially longer thanfor sensing a conventional flash cell. (The sensing process formulti-level cells can possibly be accelerated at the expense of sensingaccuracy; however, this can necessitate additional error correctioncircuitry for the memory.)

SUMMARY

In view of the foregoing considerations, the present invention isdirected to a flash memory device, and to a corresponding method ofoperating a flash memory device.

In one embodiment of the invention, a flash memory device comprises aplurality flash memory cells logically arranged as an array of rows andcolumns, with each column organized as a plurality of multi-bit words.In accordance with one aspect of the invention, the flash memory cellsare of the multi-level or multi-bit variety, capable of being programmedto have threshold values corresponding to any of a plurality ofmulti-bit bit-sets. In a particular embodiment of the invention, forexample, the flash memory cells are two-bit memory cells for which fourseparate threshold voltage ranges corresponding to the bit sets (0,0),(0,1), (1,0) and (1,1) are defined.

In accordance with another aspect of the invention, the flash memorydevice is implemented with a piplined, RAS/CAS architecture and isoperable in a burst mode of operation in which data in a given row ofthe memory array is outputted in a burst of successive wordssynchronized to an externally-applied clock signal.

In accordance with another aspect of the invention, following initiationof a first burst read operation, but before completion thereof, a secondburst read operation may be initiated, such that upon completion of thefirst burst read operation, the second burst read operation has advancedto the internal latching phase, such that the sensing latency associatedwith multi-level flash memory cells is avoided.

BRIEF DESCRIPTION OF THE DRAWINGS

The foregoing and other features and aspects of the present inventionwill be best understood with reference to the following detaileddescription of a specific embodiment of the invention, when read inconjunction with the accompanying drawings, wherein:

FIG. 1 a illustrates the cell data map for a conventional flash memorycell;

FIG. 1 b illustrates the cell data map for a multi-level memory cell;

FIG. 2 a is a simplified block diagram of a synchronous flash memorydevice in accordance with one embodiment of the invention;

FIG. 2 b is an integrated circuit pin interconnect diagram for oneembodiment of the invention;

FIG. 2 c is an integrated circuit interconnection bump grid arraydiagram of an alternative embodiment of the invention;

FIG. 3 is a timing diagram for burst read operations for a memory devicehaving conventional flash memory cells;

FIG. 4 is a timing diagram for burst read operations performed by thememory device of FIG. 2 a having multi-bit memory cells;

FIG. 5 is a timing diagram showing the logical level of signals uponinitiation of a burst read operation of the memory device of FIG. 2 a;

FIG. 6 is a timing diagram illustrating the timing of consecutive readburst operations of the memory device of FIG. 2 a;

FIG. 7 is a timing diagram illustrating random read accesses within apage of the memory device of FIG. 2 a; and

FIG. 8 is a timing diagram illustrating a burst read operation that isterminated using a burst terminate command according to one embodimentof the invention.

DETAILED DESCRIPTION

In the disclosure that follows, in the interest of clarity, not allfeatures of actual implementations are described. It will of course beappreciated that in the development of any such actual implementation,as in any such project, numerous engineering and programming decisionsmust be made to achieve the developers' specific goals and subgoals(e.g., compliance with system and technical constraints), which willvary from one implementation to another. Moreover, attention willnecessarily be paid to proper engineering practices for the environmentin question. It will be appreciated that such a development effort mightbe complex and time-consuming, but would nevertheless be a routineundertaking for those of ordinary skill in the relevant fields.

Furthermore, for the purposes of the present disclosure, the terms“comprise” and “comprising” shall be interpreted in an inclusive,non-limiting sense, recognizing that an element or method step said to“comprise” one or more specific components may include additionalcomponents. Also, it is to be understood that the terms “coupled” and“coupled to” as used to describe the interrelationship of two recitedelements shall be interpreted so as to not exclude the possibility ofintermediate elements disposed between the recited elements. That is, afirst element may be “coupled to” a second element indirectly by meansof one or more additional elements (for example (without limitation), aresistor, a transistor, or an inverter, and the terms “coupled” and“coupled to” shall necessarily not be interpreted as either implying orexcluding being “coupled directly” or “coupled directly to.” Such adistinction is especially relevant in situations where a first elementis “selectively” coupled to a second element, for example through thesource-to-drain path of a transistor, or where a logic signal passesthrough an even number of inverters.

Referring to FIG. 2 a, a block diagram of one embodiment of the presentinvention is described. The memory device 100 includes an array ofnon-volatile flash memory cells 102. The array is arranged in aplurality of addressable banks. In one embodiment, the memory containsfour memory banks 104, 106, 108 and 110. Each memory bank containsaddressable sectors of memory cells. The data stored in the memory canbe accessed using externally provided location addresses received byaddress register 112. The addresses are decoded using row addressmultiplexer circuitry 114. The addresses are also decoded using bankcontrol logic 116 and row address latch and decode circuitry 118. Toaccess an appropriate column of the memory, column address counter andlatch circuitry 120 couples the received addresses to column decodecircuitry 122. Circuit 124 provides input/output gating, data masklogic, read data latch circuitry and write driver circuitry. Data isinput through data input registers 126 and output through data outputregisters 128. Command execution logic 130 is provided to control thebasic operations of the memory device. A state machine 132 is alsoprovided to control specific operations performed on the memory arraysand cells. A status register 134 and an identification register 136 canalso be provided to output data.

In accordance with a significant aspect of the present invention, memorycells 102 are multi-level or multi-bit flash memory cells each capableof storing more than one bit of information. Each time an individualmulti-level flash memory cell is sensed, more than one bit of data isobtained. Thus, for example, in a memory organized for storingsixteen-bit words (a “by-sixteen” or “×16” part), only eight memorycells are needed to store each word.

As noted above, potential disadvantage of using multi-level flash memorycells is the inherent slowness in sensing multi-level flash memory cellsas compared with conventional one-bit flash memory cells. However, aswill be hereinafter described in greater detail, the effects of thisslowness can be substantially minimized, particularly when performingburst read operations.

FIG. 2 b illustrates an interconnect pin assignment of one embodiment ofthe present invention. The memory package 150 has 54 interconnect pins.The pin configuration is substantially similar to commercially-availableSDRAM packages. Two interconnects specific to the flash memory devicepresent invention are RP# 152 and Vccp 154. Although the presentinvention may share interconnect labels that are appear the same asSDRAM's, the function of the signals provided on the interconnects aredescribed herein and should not be equated to SDRAM's unless set forthherein. FIG. 2 c illustrates one embodiment of a memory package 160 thathas bump connections instead of the pin connections of FIG. 2 b. Thepresent invention, therefore, is not limited to a specific packageconfiguration.

Prior to describing the operational features of the memory device, amore detailed description of the interconnect pins and their respectivesignals is provided. The input clock connection is used to provide aclock signal (CLK). The clock signal can be driven by a system clock,and all synchronous flash memory input signals are sampled on thepositive edge of CLK. CLK also increments an internal burst counter andcontrols the output registers.

The input clock enable (CKE) connection is used to activate (HIGH state)and deactivates (LOW state) the CLK signal input. Deactivating the clockinput provides POWER-DOWN and STANDBY operation (where all memory banksare idle), ACTIVE POWER-DOWN (a memory row is ACTIVE in either bank) orCLOCK SUSPEND operation (burst/access in progress). CKE is synchronousexcept after the device enters power-down modes, where CKE becomesasynchronous until after exiting the same mode. The input buffers,including CLK, are disabled during power-down modes to provide lowstandby power. CKE may be tied HIGH in systems where power-down modes(other than RP# deep power-down) are not required.

The chip select (CS#) input connection provides a signal to enable(registered LOW) and disable (registered HIGH) a command decoderprovided in the command execution logic. All commands are masked whenCS# is registered HIGH. Further, CS# provides for external bankselection on systems with multiple banks, and CS# can be considered partof the command code; but may not be necessary.

The input command input connections for RAS#, CAS#, and WE# (along withCAS#, CS#) define a command that is to be executed by the memory, asdescribed in detail below. The input/output mask (DQM) connections areused to provide input mask signals for write accesses and an outputenable signal for read accesses. Input data is masked when DQM issampled HIGH during a WRITE cycle. The output buffers are placed in ahigh impedance (High-Z) state (after a two-clock latency) when DQM issampled HIGH during a READ cycle. DQML corresponds to data connectionsDQ0-DQ7 and DQMH corresponds to data connections DQ8-DQ15. DQML and DQMHare considered to be the same state when referenced as DQM.

Address inputs 133 are primarily used to provide address signals. In theillustrated embodiment the memory has 12 lines (A0-A11). Other signalscan be provided on the address connections, as described below. Theaddress inputs are sampled during an ACTIVE command (row-address A0-A11)and a READ/WRITE command (column-address A0-A7) to select one locationin a respective memory bank. The address inputs are also used to providean operating code (OpCode) during a LOAD COMMAND REGISTER operation,explained below. Address lines A0-A11 are also used to input modesettings during a LOAD MODE REGISTER operation.

An input reset/power-down (RP#) connection 152 is used for reset andpower-down operations. Upon initial device power-up, a 100 μs delayafter RP# has transitioned from LOW to HIGH is required in oneembodiment for internal device initialization, prior to issuing anexecutable command. The RP# signal clears the status register, sets theinternal state machine (ISM) 132 to an array read mode, and places thedevice in a deep power-down mode when LOW. During power down, all inputconnections, including CS# 142, are “Don't Care” and all outputs areplaced in a High-Z state. When the RP# signal is equal to a VHH voltage(5 V), all protection modes are ignored during WRITE and ERASE. The RP#signal also allows a device protect bit to be set to 1 (protected) andallows block protect bits of a 16 bit register, at locations 0 and 15 tobe set to 0 (unprotected) when brought to VHH. The protect bits aredescribed in more detail below. RP# is held HIGH during all other modesof operation.

Bank address input connections, BA0 and BA1 define which bank an ACTIVE,READ, WRITE, or BLOCK PROTECT command is being applied. The DQ0-DQ15connections 143 are data bus connections used for bi-directional datacommunication. Referring to FIG. 2 b, a VCCQ connection is used toprovide isolated power to the DQ connections to improved noise immunity.In one embodiment, VCCQ=Vcc or 1.8 V±0.15 V. The VSSQ connection is usedto isolated ground to DQs for improved noise immunity. The VCCconnection provides a power supply, such as 3 V. A ground connection isprovided through the Vss connection. Another optional voltage isprovided on the VCCP connection 144. The VCCP connection can be tiedexternally to VCC, and sources current during device initialization,WRITE and ERASE operations. That is, writing or erasing to the memorydevice can be performed using a VCCP voltage, while all other operationscan be performed with a VCC voltage. The Vccp connection is coupled to ahigh voltage switch/pump circuit 145.

In one embodiment, the invention comprises a nonvolatile, electricallysector-erasable (flash), programmable read-only memory containing33,554,432 multi-level memory cells functionally organized as 4,194,304words by 16 bits. Other population densities are contemplated, and thepresent invention is not limited to the example density. Each memorybank is organized into four independently erasable blocks (16 total). Toensure that critical firmware is protected from accidental erasure oroverwrite, the memory can include sixteen 512K-word hardware andsoftware lockable blocks. The memory's four-bank architecture supportstrue concurrent operations.

A read access to any bank can occur simultaneously with a backgroundWRITE or ERASE operation to any other bank. The synchronous flash memoryhas a synchronous interface (all signals are registered on the positiveedge of the clock signal, CLK). Read accesses to the memory can be burstoriented. That is, memory accesses start at a selected location andcontinue for a programmed number of locations in a programmed sequence.Read accesses begin with the registration of an ACTIVE command, followedby a READ command. The address bits registered coincident with theACTIVE command are used to select the bank and row to be accessed. Theaddress bits registered coincident with the READ command are used toselect the starting column location and bank for the burst access.

The synchronous flash memory provides for programmable read burstlengths of 1, 2, 4 or 8 locations, or the full page, with a burstterminate option. Further, the synchronous flash memory uses an internalpipelined architecture to achieve high-speed operation. Advantageously,and in accordance with one embodiment of the invention, becausemulti-level flash memory cells are used, fewer cells are needed toachieve the same overall storage capacity. In particular, for a memorydevice incorporating two-bit flash memory cells, one-half the number ofcells would be required as compared with a memory using single-bitmemory cells.

The synchronous flash memory can operate in low-power memory systems,such as systems operating on three volts. A deep power-down mode isprovided, along with a power-saving standby mode. All inputs and outputsare low voltage transistor-transistor logic (LVTTL) compatible. Thesynchronous flash memory offers substantial advances in Flash operatingperformance, including the ability to synchronously burst data at a highdata rate with automatic column address generation and the capability torandomly change column addresses on each clock cycle during a burstaccess.

In general, the synchronous flash memory is configured similar to amulti-bank DRAM that operates at low voltage and includes a synchronousinterface. Each of the banks is organized into rows and columns. Priorto normal operation, the synchronous flash memory is initialized. Thefollowing sections provide detailed information covering deviceinitialization, register definition, command descriptions and deviceoperation.

The synchronous flash is powered up and initialized in a predefinedmanner. After power is applied to VCC, VCCQ and VCCP (simultaneously),and the clock signal is stable, RP# 140 is brought from a LOW state to aHIGH state. A delay, such as a 100 μSec delay, is needed after RP#transitions HIGH in order to complete internal device initialization.After the delay time has passed, the memory is placed in an array readmode and is ready for Mode Register programming or an executablecommand. After initial programming of a non-volatile mode register 147(NVMode Register), the contents are automatically loaded into a volatileMode Register 148 during the initialization. The device will power up ina programmed state and will not require reloading of the non-volatilemode register 147 prior to issuing operational commands. This isexplained in greater detail below.

The Mode Register 148 is used to define the specific mode of operationof the synchronous flash memory. This definition includes the selectionof a burst length, a burst type, a CAS latency, and an operating mode.The Mode Register is programmed via a LOAD MODE REGISTER command andretains stored information until it is reprogrammed. The contents of theMode Register may be copied into the NVMode Register 147. The NVModeRegister settings automatically load the Mode Register 148 duringinitialization. Details on ERASE NVMODE REGISTER and WRITE NVMODEREGISTER command sequences are provided below. Those skilled in the artwill recognize that an SDRAM requires that a mode register must beexternally loaded during each initialization operation. The presentinvention allows a default mode to be stored in the NV mode register147. The contents of the NV mode register are then copied into avolatile mode register 148 for access during memory operations.

Mode Register bits M0-M2 specify a burst length, M3 specifies a bursttype (sequential or interleaved), M4-M6 specify a CAS latency, M7 and M8specify a operating mode, M9 is set to one, and M10 and M11 are reservedin this embodiment. Because WRITE bursts are not currently implemented,M9 is set to a logic one and write accesses are single location(non-burst) accesses. The Mode Register must be loaded when all banksare idle, and the controller must wait the specified time beforeinitiating a subsequent operation.

Read accesses to the synchronous flash memory can be burst oriented,with the burst length being programmable, as shown in Table 1. The burstlength determines the maximum number of column locations that can beautomatically accessed for a given READ command. Burst lengths of 1, 2,4, or 8 locations (words) are available for both sequential and theinterleaved burst types, and a full-page burst is available for thesequential type. The full-page burst can be used in conjunction with theBURST TERMINATE command to generate arbitrary burst lengths that is, aburst can be selectively terminated to provide custom length bursts.When a READ command is issued, a block of columns equal to the burstlength is effectively selected. All accesses for that burst take placewithin this block, meaning that the burst will wrap within the block ifa boundary is reached. The block is uniquely selected by A1-A7 when theburst length is set to two, by A2-A7 when the burst length is set tofour, and by A3-A7 when the burst length is set to eight. The remaining(least significant) address bit(s) are used to select the startinglocation within the block. Full-page bursts wrap within the page if theboundary is reached.

Accesses within a given burst may be programmed to be either sequentialor interleaved; this is referred to as the burst type and is selectedvia bit M3. The ordering of accesses within a burst is determined by theburst length, the burst type and the starting column address, as shownin Table 1. TABLE 1 BURST DEFINITION STARTING ORDER OF ACCESSES COLUMNWITHIN A BURST BURST ADDRESS TYPE = TYPE = LENGTH A2 A1 A0 SEQUENTIALINTERLEAVED  2 0 0-1 0-1 1 1-0 1-0  4 0 0 0-1-2-3 0-1-2-3 0 1 1-2-3-01-2-3-0 1 0 2-3-0-1 2-3-0-1 1 1 3-0-1-2 3-0-1-2 0 0 0 0-1-2-3-4-5-6-70-1-2-3-4-5-6-7 0 0 1 1-2-3-4-5-6-7-0 1-2-3-4-5-6-7-0 0 1 02-3-4-5-6-7-0-1 2-3-4-5-6-7-0-1 0 1 1 3-4-5-6-7-0-1-2 3-4-5-6-7-0-1-2 10 0 4-5-6-7-0-1-2-3 4-5-6-7-0-1-2-3 1 0 1 5-6-7-0-1-2-3-45-6-7-0-1-2-3-4 1 1 0 6-7-0-1-2-3-4-5 6-7-0-1-2-3-4-5 1 1 17-0-1-2-3-4-5-6 7-0-1-2-3-4-5-6 Full n = A0-A7 Cn, Cn + 1, Not SupportedPage (location 0-255) Cn + 2 256 Cn + 3, Cn + 4 . . . Cn − 1, Cn . . .

Column Address Strobe (CAS) latency is a delay, in clock cycles, betweenthe registration of a READ command and the availability of the firstpiece of output data on the DQ connections. The latency can be set toone, two or three clocks cycles. For example, if a READ command isregistered at clock edge n, and the latency is m clocks, the data willbe available by clock edge n+m. The DQ connections will start drivingdata as a result of the clock edge one cycle earlier (n+m−1) and,provided that the relevant access times are met, the data will be validby clock edge n+m. For example, assuming that the clock cycle time issuch that all relevant access times are met, if a READ command isregistered at T0, and the latency is programmed to two clocks, the DQswill start driving after T1 and the data will be valid by T2. The normaloperating mode is selected by setting M7 and M8 to zero, and theprogrammed burst length applies to READ bursts.

The following truth tables summarize generally the operation commands ofan embodiment of the memory of the present invention. A more detaileddescription of the operation commands is provided in theabove-referenced Roohparvar '049 patent. TRUTH TABLE 1 InterfaceCommands and DQM Operation NAME (FUNCTION) CS # RAS # CAS # WE # DQMADDR DQs COMMAND H X X X X X X INHIBIT (NOP) NO OPERATION L H H H X X X(NOP) ACTIVE (Select L L H H X Bank/ X bank and activate Row row) READ(Select L H L H X Bank/ X bank, column, Col and start READ burst) WRITE(Select L H L L X Bank/ Valid bank, column, Col and start WRITE) BURST LH H L X X Active TERMINATE ACTIVE L L H L X X X TERMINATE LOAD L L L H XCom Code X COMMAND Code REGISTER LOAD MODE MODE L L L L Op Code XREGISTER Code Write — — — — L — Active Enable/Output Write — — — — H —High-Z Inhibit/Output High-Z

TRUTH TABLE 2 Flash Memory Command Sequences 1^(st) Cycle 2^(nd) Cycle3^(rd) Cycle Operation CMD ADDR ADDR DQ RP# CMD ADDR ADDR DQ RP# CMDADDR ADDR DQ RP# READ LCR 90H Bank X H ACTIVE Row Bank X H READ CA BankX H DEVICE Config READ Status LCR 70H X X H ACTIVE X X X H READ X X X HRegister CLEAR LCR 50H X X H Status Register ERASE LCR 20H Bank X HACTIVE Row Bank X H WRITE X Bank D0H H/V_(HH) SETUP/Confirm WRITE LCR40H Bank X H ACTIVE Row Bank X H WRITE Col Bank DIN H/V_(HH) SETUP/WRITE Protect LCR 60H Bank X H ACTIVE Row Bank X H WRITE X Bank 01HH/V_(HH) BLOCK/ Confirm Protect LCR 60H Bank X H ACTIVE X Bank X H WRITEX Bank F1H V_(HH) DEVICE/ \Confirm Unprotect LCR 60H Bank X H ACTIVE XBank X H WRITE X Bank D0H H/V_(HH) BLOCKS/ Confirm ERASE LCR 30H Bank XH ACTIVE X Bank X H WRITE X Bank C0H H NVmode Register WRITE LCR A0HBank X H ACTIVE X Bank X H WRITE X Bank X H NVmode Register

READ bursts are initiated with a READ command (defined by CS#, WE#,RAS#, CAS#). The starting column and bank addresses are provided withthe READ command. During READ bursts, the valid data-out element fromthe starting column address will be available following the CAS latencyafter the READ command. Each subsequent data-out element will be validby the next positive clock edge. Upon completion of a burst, assuming noother commands have been initiated, the DQs will go to a High-Z state. Afull page burst will continue until terminated. (At the end of the page,it will wrap to column 0 of the same page and continue.) Data from anyREAD burst may be truncated with a subsequent READ command, and datafrom a fixed-length READ burst may be immediately followed by data froma subsequent READ command. In either case, a continuous flow of data canbe maintained. The first data element from the new burst follows eitherthe last element of a completed burst, or the last desired data elementof a longer burst that is being truncated. The new READ command shouldbe issued x cycles before the clock edge at which the last desired dataelement is valid, where x equals the CAS latency minus one. This isshown in FIG. 6 for CAS latencies of one, two and three; data elementn+3 is either the last of a burst of four, or the last desired of alonger burst. The synchronous flash memory uses a pipelined architectureand therefore does not require the 2n rule associated with a prefetcharchitecture. A READ command can be initiated on any clock cyclefollowing a previous READ command. Full-speed, random read accesseswithin a page can be performed as shown in FIG. 6, or each subsequentREAD may be performed to a different bank.

Data from any READ burst may be truncated with a subsequent WRITEcommand (WRITE commands must be preceded by WRITE SETUP), and data froma fixed-length READ burst may be immediately followed by data from asubsequent WRITE command (subject to bus turnaround limitations). TheWRITE may be initiated on the clock edge immediately following the last(or last desired) data element from the READ burst, provided that I/Ocontention can be avoided. In a given system design, there may be thepossibility that the device driving the input data would go Low-Z beforethe synchronous flash memory DQs go High-Z. In this case, at least asingle-cycle delay should occur between the last read data and the WRITEcommand.

A fixed-length or full-page READ burst can be truncated with eitherACTIVE TERMINATE (may or may not be bank specific) or BURST TERMINATE(not bank specific) commands. The ACTIVE TERMINATE or BURST TERMINATEcommand should be issued x cycles before the clock edge at which thelast desired data element is valid, where x equals the CAS latency minusone. This is shown in FIG. 7 for each possible CAS latency; data elementn+3 is the last desired data element of a burst of four or the lastdesired of a longer burst.

It is believed that further detail as to the functional operation ofmemory device 100 in accordance with the presently disclosed embodimentof the invention is not necessary for an understanding of the presentinvention. It is sufficient to clarify that memory 100 operatessubstantially as described in the aforementioned U.S. Pat. No.6,314,049.

The '049 patent can be characterized generally as describing anon-volatile synchronous flash memory that, notably, is compatible withexisting SDRAM package pin assignments and control signal definition andtiming specifications. To achieve this, the memory described in the '049patent utilizes command execution logic which serves as a translatorbetween the externally-applied SDRAM control signals and the internalflash memory. Thus, for example, whereas conventional flash memoryaccesses involve assertion of an ACTIVE signal to select a desiredmemory bank and activate a row, and a subsequent assertion of a READsignal to select columns within the selected row, the memory in the '049patent translates such functionality into a RAS and CAS operationalmodel. Under such a model, the RAS cycle corresponds generally into theACTIVE portion of the flash memory access cycle, while the CAS cyclecorresponds generally to the READ portion of the flash memory accesscycle. The present invention builds upon the concepts of the '049 patentby further introducing the concept of utilizing multi-bit memory cellsinto the flash memory, while continuing to maintain the SDRAM interfaceto the outside world.

Turning now to FIGS. 3 and 4, there are shown timing diagrams comparingburst read operations performed by prior art flash memory devices havingone bit-per-cell flash cells and memory devices in accordance with oneembodiment of the present invention, having two (or more) bits-per-cellflash memory cells. As shown in FIG. 3, operation of the memory devicesis controlled by a system clock CLK, and in particular, operation iscoordinated with rising edges of the CLK signal. In the example shown inFIG. 3, the CLK signal may be, for example, a 50 Mhz clock having acycle length of 20 nSec.

As with a flash memory device as disclosed in the '049 patent, a burstread operation is initiated by assertion (low) of an ACTIVE signalfollowed by assertion of a READ signal while a write enable (WE#) signalis held unasserted (high). Following assertion of the ACTIVE signal,there is a first latency period which must elapse before the READ signalcan be asserted, and there is a second latency period which elapsesafter assertion of the READ signal before valid output data words beginto appear on the data output (DQ) pins of the device. These first andsecond latency periods are collectively referred to as the read latencyof the device.

In FIG. 3, signal DQ represents the output from a typicalone-bit-per-cell flash memory device. The read latency following a READcommand (assertion of the row address strobe or RAS signal) for thisdevice is six clock cycles. After this latency, a valid data word isavailable on the DQ output pins for each subsequent cycle for theduration of the data burst, which in the exemplary embodiment of FIG. 3is programmed to a burst length of eight. After the data burst, anotherburst read operation can be initiated by again asserting RAS. Anotherburst of data words appears on the DQ output terminals following thelatency.

On the other hand, output signal DQ depicted in FIG. 4 represents theoutput of a flash memory device in accordance with one embodiment of theinvention incorporating two-bit-per-cell flash memory cells. In thiscase, the read latency following assertion of the RAS signal to initiatea burst read operation is nine, rather than six cycles, reflecting thelonger time necessary to sense multi-bit flash memory cells as discussedin detail above. As can be seen in FIG. 4, there is a longer latencyonly before the first of a sequence of successive burst read accesses;the longer latency for subsequent accesses is effectively “masked”through assertion of the RAS and CAS signals at the appropriate timesduring the previous burst write command. Apart from this initiallatency, memory device 100 employs an architecture for enabling device100 to behave as though it were a conventional synchronous DRAM, i.e.,it is responsive to assertion of RAS and CAS signals to initiate readand write operations and conforms to the industry standard pin-outdefinitions for synchronous DRAMs.

As discussed above with reference to FIGS. 2 a and 6, a burst read cycleis initiated through issuance of a READ command. In accordance with oneembodiment of the invention, issuance of a READ command causes an entirerow, or page, of memory cells to be sensed and latched in the read datalatch circuitry within circuit 124 shown in FIG. 2. In one embodiment, arow of cells comprises 2048 multi-level cells. The location within therow at which the read burst begins is specified by the column addressapplied to the address inputs upon assertion of the CAS signal.

In the exemplary embodiment of FIG. 4, memory device 100 is programmedto a burst length of eight. Data is first available on the DQ outputpins following a latency period, which in the embodiment of FIG. 4 isnine clock cycles. However, consecutive words are available on eachclock cycle thereafter, since the READ command causes the entire row tobe latched at once.

As those of ordinary skill in the art having the benefit of thisdisclosure will appreciate, the pipelined RAS/CAS architecture of memorydevice 100 is such that the inherent slower speed of the sense amplifierdetects cycle for multi-bit flash memory cells can be effectively“hidden” for all but the first access in a burst read. Though theinitial access to a page of multi-bit flash cells is slower due to thesense amplifiers resolving smaller voltage levels, once the voltagelevels for an entire page are sensed and latched, a flash memory deviceemploying multi-bit flash memory cells can burst at the same performance(for the latched page) as a device utilizing one-bit-per-cell flashmemory cells.

By using a pipelined RAS/CAS architecture such as shown in FIG. 2 a, theinitial access will become less significant because subsequent accessesare initiated in the background while the current burst operation istaking place. The result is that the initial single access will beslower, as is typical of multi-bit flash memory cells, but the delay insubsequent accesses can be hidden due to the RAS/CAS architecture.

From the foregoing detailed description of a specific embodiment of theinvention, it should be apparent that a flash memory deviceincorporating multi-bit-per-cell flash memory cells has been disclosed.In accordance with one aspect of the invention, the memory deviceemploys a RAS/CAS architecture enabling the device to operate inaccordance with the timing and signal specifications of a conventionalsynchronous DRAM, while at the same time offering the advantage ofnon-volatility of flash memory devices.

Although a specific embodiment of the invention has been disclosedherein in some detail, it is to be understood that this has been donesolely to illustrate various features and aspects of the presentinvention, and is not intended to be limiting with respect to the scopeof the invention as defined in the appended claims, which follow. It iscontemplated that various substitutions, alterations, and/ormodifications, including but not limited to those design alternativesthat may have been specifically discussed herein, may be made to thedisclosed embodiment(s) without departing from the spirit and scope ofthe invention as defined in the claims.

For example, the present invention has been described herein in thecontext of a memory device having a particular capacity and operating ata particular clock speed. Those of ordinary skill in the art willunderstand that the invention is by no means limited to these specificoperational parameters or design considerations, and further that thepresent invention may be advantageously practiced in the context of awide variety of different RAS/CAS or pipelined memory architectures.

1. A method of operating a semiconductor memory device having multi-bitnon-volatile memory cells, comprising: activating a first burst readutilizing a first Row Address Strobe signal followed by a first ColumnAddress Strobe signal, the first burst read mode addressing a firstplurality of multi-bit non-volatile memory cells; sequentiallyoutputting first multi-bit outputs for each of the first plurality ofaddressed multi-bit non-volatile cells; activating a second burst readutilizing a second Row Address Strobe signal followed by a second ColumnAddress Strobe signal, the second burst read mode addressing a secondplurality of multi-bit non-volatile memory cells; and sequentiallyoutputting second multi-bit outputs for each of the second plurality ofaddressed multi-bit non-volatile cells, wherein the second mutli-bitoutputs are output immediately after the first multi-bit outputs withoutlatency.
 2. The method of claim 1, wherein the second burst read isactivated simultaneously with outputting the first mutli-bit outputs. 3.The method of claim 1, wherein the first and second Row Address Strobesignals are accompanied by application of an externally-applied rowaddress to the memory device, and wherein the first and second ColumnAddress Strobe signals are accompanied by application of anexternally-applied column address to the memory device.
 4. The method ofclaim 1, wherein values of the first and second multi-bit outputs foreach flash cell corresponds to a four threshold voltages for each flashcell.
 5. The method of claim 1, wherein the first or second plurality ofmulti-bit flash cells are formed in a single row of the memory device.6. The method of claim 1, wherein the latency between the Row AccessStrobe signals and the Column Access Strobe signals is sufficiently longto resolve the status of the multi-bit outputs for each of the pluralityof multi-bit flash cells.
 7. The method of claim 1, wherein the RowAddress Strobe and Column Address Strobe signals are applied externallyto the memory device.
 8. The method of claim 1, wherein the Row AccessStrobe signals and the Column Address Strobe signals are synchronouswith a clock signal applied externally to the memory device.
 9. Themethod of claim 1, wherein the multi-bit outputs are output insynchronization with a clock signal applied externally to the memorydevice.
 10. The method of claim 1, wherein the multi-bit non-volatilememory cells comprise multi-bit flash memory cells.
 11. A method ofoperating a semiconductor memory device comprising an array of rows andcolumns of non-volatile memory cells, comprising: programming aplurality of the non-volatile memory cells to more than two possiblethreshold voltages, wherein the more than two threshold voltages eachcorrespond to multi-bit bit-sets; in response to a row address, sensingthe threshold voltages of the plurality of memory cells along a row ofthe memory device; translating each sensed threshold voltage into itsmulti-bit bit-sets to form read data; and in response to a columnaddress, sequentially outputting the read data starting at the columnaddress.
 12. The method of claim 11, wherein the row address isaccompanied by the external application of a Row Address Strobe signalto the memory device.
 13. The method of claim 11, wherein the columnaddress is accompanied by the external application of a Column AddressStrobe signal to the memory device.
 14. The method of claim 11, whereinthe method comprises programming the plurality of the non-volatilememory cells to four possible threshold voltages, and wherein the fourpossible threshold voltages correspond to two-bit bit-sets.
 15. Themethod of claim 11, wherein a latency between the Row Access Strobesignals and the Column Access Strobe signals is sufficiently longtranslate each sensed threshold voltage into its multi-bit bit-sets. 16.The method of claim 11, wherein the row address and the column addressare synchronous with a clock signal applied externally to the memorydevice.
 17. The method of claim 11, wherein the read data is output insynchronization with a clock signal applied externally to the memorydevice.
 18. The method of claim 11, wherein the non-volatile memorycells comprise flash memory cells.
 19. The method of claim 11, furthercomprising latching the read data in a latch prior to outputting theread data in response to the column address.